With the rapid development of wireless communication and mobile communication technologies, the market demand for miniaturization, high performance, light weight and low cost are becoming more and more apprehensive. However, the Moore's Law followed by the integrated circuit has almost reached its end. Once the width of the line on the chip reaches the order of nanometers, the physical, chemical and performance properties of the material will change qualitatively, so that the semiconductor device basing on the current process will not work properly.

The natural defects of the popular SoC (System on Chip) are destined to be not suitable for the development of technology, mainly shows in the technology compatibility which integrating digital circuits, analog circuits, RF, microwave circuits and other function dies on one chips technically .In addition, due to the complexity of the system, long-time product development cycle, design errors, product delays and repeated chip manufacturing factors will lead to a significant increase in costs.

System-in-package (SiP) has emerged as an significant solution to solve this problem.

Our SiP solution is to put different types of chips into one package in three-dimensional space to form a complete system package technology.

For the SiP solution, it not only can effectively reduce the size of the system, improve product performance, but also has the following advantages:

· Large-scale, multi-chip, three-dimensional miniaturization

· Integrated in one package (mixed signal) with power supplies, digital circuits, RF, IPD, MEMS sensor, image and other functional chips

· Make full use of existing chip resources

· Significantly shorten product launch cycle and production costs

With the leading SIP packaging technology of world wide, we can integrate a variety of functional chips, including power supplies, processor, memory and other functional chips into one package, to achieve complete functions, widely used in computers, automotive electronics, medical electronics, and consumer electronics field.

We have the national leading and lightning fast-sealing platform, including SIP design services, manufacturing packaging and testing services. Our partners are more than 1,000 companies and 300,000 professional users in the semiconductor industry chain which cover IC design, EDA / IP, Wafer processing, packaging testing, semiconductor equipment and materials, program design, distribution agency, and so on. And we also have the most extensive cooperation channels for bare dies.